The present paper proposes a methodology that, starting from a set of calibration measurements picked up only at the external pins of the package, allows the determination of its representative matrix. Such a matrix can be used both for a correct measurement of the embedded device and in view of improving its design, by accounting for the effect of the package. The technique is demonstrated over a packaged passive integrated inductor.
A Methodology for RF Modeling of Packages Using IC Known-Loads / Ballicchia, Mauro; Farina, Marco; Morini, Antonio; Rozzi, Tullio; Turchetti, Claudio; Orcioni, Simone. - STAMPA. - (2011), pp. 69-72. (Intervento presentato al convegno 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. tenutosi a San Jose, California nel October 23-26, 2011).
A Methodology for RF Modeling of Packages Using IC Known-Loads
BALLICCHIA, MAURO;FARINA, Marco;MORINI, ANTONIO;ROZZI, TULLIO;TURCHETTI, Claudio;ORCIONI, Simone
2011-01-01
Abstract
The present paper proposes a methodology that, starting from a set of calibration measurements picked up only at the external pins of the package, allows the determination of its representative matrix. Such a matrix can be used both for a correct measurement of the embedded device and in view of improving its design, by accounting for the effect of the package. The technique is demonstrated over a packaged passive integrated inductor.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
