The present paper proposes a methodology that, starting from a set of calibration measurements picked up only at the external pins of the package, allows the determination of its representative matrix. Such a matrix can be used both for a correct measurement of the embedded device and in view of improving its design, by accounting for the effect of the package. The technique is demonstrated over a packaged passive integrated inductor.

A Methodology for RF Modeling of Packages Using IC Known-Loads

BALLICCHIA, MAURO;FARINA, Marco;MORINI, ANTONIO;ROZZI, TULLIO;TURCHETTI, Claudio;ORCIONI, Simone
2011-01-01

Abstract

The present paper proposes a methodology that, starting from a set of calibration measurements picked up only at the external pins of the package, allows the determination of its representative matrix. Such a matrix can be used both for a correct measurement of the embedded device and in view of improving its design, by accounting for the effect of the package. The technique is demonstrated over a packaged passive integrated inductor.
9781424493999
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11566/63204
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