We investigate some mathematical and numerical methods based on asymptotic expansions for the modeling of bonding interfaces in the presence of linear coupled multiphysic phenomena. After reviewing new recently proposed imperfect contact conditions (Serpilli et al., 2019), we present some numerical examples designed to show the efficiency of the proposed methodology. The examples are framed within two different multiphysic theories, piezoelectricity and thermo-mechanical coupling. The numerical investigations are based on a finite element approach generalizing to multiphysic problems the procedure developed in Dumont et al. (2018).
Numerical Validation of Multiphysic Imperfect Interfaces Models / Dumont, S.; Serpilli, M.; Rizzoni, R.; Lebon, F. C.. - In: FRONTIERS IN MATERIALS. - ISSN 2296-8016. - ELETTRONICO. - 7:(2020). [10.3389/fmats.2020.00158]