Mold heating is an important key factor for themold cycle which affects the quality of the molded product. Theinvolved molding processes regards polymers foaming, plastics in-jection, or resin-curing with composites. While the manufacturingcycle of plastics injection molding requires a heating/cooling sys-tem, other processes do not require the cooling phase. Polymersfoaming and resin-curing require specific values of temperatureto provide full chemical reactions and a good product qualityon the surface. Induction heating systems are suitable for suchapplications; however, many industrial cases require customizedsolutions to support the molding cycle of different parts. Atemperature control is always mandatory to reduce the energycost and increase the heating efficiency. This paper studies amolds temperature control applied in the polyurethane foamingof footwear soles. The proposed induction heating system andits control have been studied using the Hardware-In-the-Loopsimulations. Due to a high mold thermal inertia, which increasesthe mold temperature even if the control system turns offthe thermal power, tailored controllers have been analyzed toachieve the desired temperature set-point. The thermal model ofthe foaming mold and the induction heating system have beenmodelled and developed in the MATLAB/Simulink® framework.An ATMEGA processor was used to implement and test a discretePID controller while Simulink induction-heating system modelwas running, creating an Hardware-In-The-loop platform.
Induction Mold Heating: Modelling and Hardware-in-the-Loop Simulation for Temperature Control / Prist, M.; Pallotta, E.; Cicconi, P.; Monteriu, A.; Germani, M.; Longhi, S.. - ELETTRONICO. - (2018), pp. 1-6. (Intervento presentato al convegno 2018 IEEE International Conference on Environment and Electrical Engineering and 2018 IEEE Industrial and Commercial Power Systems Europe (EEEIC / I&CPS Europe) tenutosi a Palermo, Italy nel June 12-15, 2018) [10.1109/EEEIC.2018.8493863].
Induction Mold Heating: Modelling and Hardware-in-the-Loop Simulation for Temperature Control
Prist, M.;Pallotta, E.;Cicconi, P.;Monteriu, A.;Germani, M.;Longhi, S.
2018-01-01
Abstract
Mold heating is an important key factor for themold cycle which affects the quality of the molded product. Theinvolved molding processes regards polymers foaming, plastics in-jection, or resin-curing with composites. While the manufacturingcycle of plastics injection molding requires a heating/cooling sys-tem, other processes do not require the cooling phase. Polymersfoaming and resin-curing require specific values of temperatureto provide full chemical reactions and a good product qualityon the surface. Induction heating systems are suitable for suchapplications; however, many industrial cases require customizedsolutions to support the molding cycle of different parts. Atemperature control is always mandatory to reduce the energycost and increase the heating efficiency. This paper studies amolds temperature control applied in the polyurethane foamingof footwear soles. The proposed induction heating system andits control have been studied using the Hardware-In-the-Loopsimulations. Due to a high mold thermal inertia, which increasesthe mold temperature even if the control system turns offthe thermal power, tailored controllers have been analyzed toachieve the desired temperature set-point. The thermal model ofthe foaming mold and the induction heating system have beenmodelled and developed in the MATLAB/Simulink® framework.An ATMEGA processor was used to implement and test a discretePID controller while Simulink induction-heating system modelwas running, creating an Hardware-In-The-loop platform.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
