Due to the rapid increases in current densities, wires, planar conductors and ground lines, become more and more vulnerable to electromigration. Future RF advanced packaging applications require new materials endowed of low electrical resistance, high reliability, chip-to-package interconnects, and improved thermal management. In this contribution, we introduce a multi-physics full-wave investigation of a CNT based interconnection bridging microstrips placed on different planar surface. The model include coupled i) electromagnetic, ii) quantum and iii) thermal analysis
Electro-thermal and quantum analysis of CNT-based interconnections / Mencarelli, D.; Stocchi, M.; Pierantoni, L.. - ELETTRONICO. - (2017), pp. 305-307. (Intervento presentato al convegno IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization for RF, Microwave, and Terahertz Applications (IEEE NEMO 2017) tenutosi a Sevilla, Spain nel May 17-19) [10.1109/NEMO.2017.7964268].
Electro-thermal and quantum analysis of CNT-based interconnections
D. Mencarelli;M. Stocchi;L. Pierantoni
2017-01-01
Abstract
Due to the rapid increases in current densities, wires, planar conductors and ground lines, become more and more vulnerable to electromigration. Future RF advanced packaging applications require new materials endowed of low electrical resistance, high reliability, chip-to-package interconnects, and improved thermal management. In this contribution, we introduce a multi-physics full-wave investigation of a CNT based interconnection bridging microstrips placed on different planar surface. The model include coupled i) electromagnetic, ii) quantum and iii) thermal analysisI documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
